Semi-Automatic Solder Paste Printer |
Features: - PLC Control System to ensure working stabilized & reliable; touch screen is easy to operate.
- High Rigidity structure and linear rails ensure the stabilities and precision of printing.
- This printer can automatically set the running parameters to comport with all kind of products and get best performance according to different characteristic of glue and solder paste.
- Flexible arming base with the arms can be adjusted toward right or left to match different size of PCB.
- The printing knife can be rotated 45c upward then fixed to convenient for the clean & replace of knife and stencils. Calibration method is to use the movement of stencil to match with X, Y, Z of printing base.
Specification: | Model Features | ET-680-SPd | ET-740-SP | | Description | Suitable for printing solder paste and glue for all kinds of thick or Thin PCB (Single or Double) | | Power Requirement | 220V AC, 50Hz, 1 Phase | | Power Consumption | 100 W | | PCB Thickness Range | 0.2 – 3.0 mm | | Fine Adjustment of Platform | + 0.05 mm | | Respectable Precision | 0 0.02 mm | | Air Supply | 4-6 Kg/cm sq | | Printing Plat form | 320 x 500 mm | 320 x 500 mm | | Stencil Dimension | 370 x 470 to 550 x 650 mm | 370 x 470 to 736 x 736 mm | | PCB Dimension | D320 x 450 mm | 320 x 500 mm | | PCB Positioning Method | Positioning Pin | Positioning Pin | | Printing Method | Stencil Movement | Stencil Movement | | Dimension | L-880, W-680, H-1650 mm | L-1000, W 870, H-1650 mm | | Weight 220 Kg | 260 Kg | |
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